Stato ALICE e ITS Upgrade · V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016 2 months:...

StatoALICEeITSUpgrade

RiunioneRefereeINFN–Roma,26Maggio2016

OnePeVCollisions

ALICEfirstyearofRUN2inone

image

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Run2

V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016

•  2015 - Primo anno di Run2 •  Dati raccolti relativi a collisioni PbPb e pp a 13 e 5 TeV •  Obiettivi raggiunti in termini di statistica •  Distorsioni nella TPC ad alto rate à nuova procedura di calibrazione, necessaria

anche per RUN3

•  2015 - Year-End Technical Stop •  Numerosi interventi di manutenzione ordinaria e straordinaria •  Upgrade dell’elettronica di readout della TPC (RCU2) à ~ raddoppio del rate di

presa dati

•  2016 – Secondo anno di Run2 •  Ripartenza senza problemi

4

LHC Schedule per il 2015


p-Pbrun~halfat8andhalfat5TeVTarget:1BillionMBeventsat5TeVand20nb-1(raretriggers)at8TeV

p-prunLuminosity:5Hz/µb(300kHz)atpile-up(μ)~1-2%likein2015Trigger:mixofMBandraretriggers(highmulZplicity,muon,Jet,γ,diffracZve)

5

Produzione Scientifica


•  Numerosi lavori pubblicati

•  151 ALICE pubblicazioni su arXiv, alcuni già relativi a dati di Run2 ed in particolare 2 alla presa dati HI di Dic ‘15

•  Pubblicazioni di elevato impatto scientifico: oltre 90 citazioni in media (inSPIRE)

•  Alcune centinaia di presentazioni all’anno in conferenze internazionali

6

ALICE Today

V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016 Muon spectrometer

7

ALICE Upgrade


NewInnerTrackingSystem(ITS)•  improvedpoinBngprecision•  lessmaterial->thinnesttrackerattheLHC

TimeProjecBonChamber(TPC)•  newGEMtechnologyforreadoutchambers

•  conBnuousreadout•  fasterreadoutelectronics

MUONARM•  conBnuousreadoutelectronics

MuonForwardTracker(MFT)•  newSitracker•  ImprovedMUONpoinBngprecision

DataAcquisiBon(DAQ)/HighLevelTrigger(HLT)•  newarchitecture•  onlinetracking&datacompression

•  50kHzPbPbeventrateTOF,TRD,ZDC•  Fasterreadout

NewTriggerDetectors(FIT)

NewCentralTriggerProcessor(CTP)

8

Approvazione degli Upgrades


The approval process for the upgrades has been completed in 2015

All 5 TDRs and respective MoUs ITS, Readout Electronics and Trigger System, O2, TPC, MFT

have been approved by LHCC, UCG and RRB

Excellent cards to play poker

9

Installazione Upgrades


2 months: opening Experiment + TPC/ITS/beampipe de-installation

10 months: TPC + other detectors upgrade + services modifications

8 months: reinstall TPC/ITS/MFT/FIT/beampipe + close Experiment

4 months: commissioning

J F M A M J L A S O N D J F M A M J L A S O N D2019 2020

10

Sviluppo di Tecnologie per gli Upgrade


Nel contesto più generale delle discussioni sugli Upgrades di Fase 1 e Fase 2 degli esperimenti ad LHC è emerso chiaramente che gli upgrades di ALICE ad oggi rappresentano in molti campi la frontiera tecnologica dei rivelatori

ALPIDEchip

ITSmechanicsandIntegraZon

4GEMTPC

O2facility

11

Leadership in Collaborazione


•  Spokesperson: P. Giubellino (To) •  Physics Coordinator: F. Antinori (Pd) •  Conference Committee: chairman E. Vercellin (To) •  Editorial Board: co-chair E. Scomparin (To) •  Run Coordination: deputy G. Luparello (Ts)

•  PWG co-Conveeners (2-year mandate): •  Heavy Flavour: E. Bruna (To) •  Light Flavour Spectra: F. Bellini (Bo) •  Physics Performance: C. Zampolli (Bo) •  Monte Carlo generators and Minimum Bias physics: E. Scapparone (Bo)

•  Project Leader and Deputy: •  ITS: V. Manzari (Ba) •  SPD: V. Manzari (Ba) •  SDD: F. Prino (To) •  HMPID: G. De Cataldo (Ba) •  TOF: A. Zichichi (Bo) •  ZDC: N. De Marco (Al) •  LHCinterface:G.De Cataldo (Ba)

12

Elezione Spokesperson


Elezione Nuovo Spokesperson (inizio mandato 1 Gennaio 2017) 4 Candidati: F. Antinori, A. Baldisseri, T. Nayak and R. Snelling

Eletto: F. Antinori (Padova)

La Costituzione ALICE richiede una maggioranza pari ad almeno 2/3 degli aventi diritto al voto per assicurare un forte mandato allo spokesperson che risulta eletto.

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ITS Upgrade - Stato Generale

•  Processo di approvazione completato

•  Attività di R&D in fase di completamento ed è iniziata la fase di ingegnerizzazione dei prototipi

•  Abbiamo cominciato ad utilizzare pesantemente i finanziamenti UCG

•  Engineering Design Reviews

•  Pixel Chip – 19 Ott 2015

•  Modulo e Stave – 3-4 Mag 2016


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EDR – Pixel Chip


ReviewPanel:A.Marchioro(CERN),W.Mueller(GSI),X.Llopart(CERN)

16"

EDR:"pALPIDEF2"results"and"pALPIDEF3"design"A"Large"Ion"Collider"Experiment"

General"Assessment"“The"reviewers"were"impressed"by"the"amount"and"the"quality"of"informaTon"provided"by"the"design"team"for"the"review."The"design"team"has"clearly"worked"very"hard"and"thoroughly"for"this"project"and"was"orchestrated"very"competently"and"effecTvely"by"its"management"team."

The"Alice"ITS"project"aims"at"introducing"some"very"original"soluTons"in"the"area"of"pixelated"detectors"for"parTcle"physics,"in"parTcular"the"new"technology,"the"sensor"architecture,"the"extremely"low"power"frontFend"circuitry"and"the"mechanical"thinning"of"the"detector,"all"are"pioneering"significant"innovaTons.""

Unavoidably"innovaTons"cannot"be"decoupled"from"risks,"but"it"seems"to"these"reviewers"that"the"team"has"studied"in"detail"the"various"aspects"of"the"design"of"the"proposed"chip"and"has"used"extensively"simulaTon"tools"to"understand"its"behavior."Of"course"the"usage"of"simulaTon"tools"must"be"accompanied"by"and"the"results"digested"with"a"fair"amount"of"common"sense,"which"has"been"expressed"during"the"review."The"engineering"team"has"shown"to"have"worked"proacTvely"on"a"number"of"issues"that"were"raised"during"the"presentaTon."

It"is"also"fair"to"noTce"that"the"learning"in"a"new"and"very"promising"monolithic"technology"that"this"project"will"hopefully"bring"to"the"HEP"community"does"by"itself"partly"jusTfy"the"risk"taken"with"the"project."

Finally,"it"was"really"a"pleasure"to"see"the"enthusiasm"and"competence"of"the"overall"team"working"on"this"project.”"

EDR"(19"Oct"2015)"F""Review"panel:"A."Marchioro"(CERN),"W."Mueller"(GSI),"X."Llopart"(CERN)"

15

Interconnessione Pixel Chip-FPC


SelecZveLaserSolderingLasersolderingmachine(Dr.MergenthalerGMBH

Chip%FPC%

Solder%balls%

Laser%

Chip

Coverlay Metal

Polyimide Metal

Coverlay

2 Layers, Vacuum deposition

20 µm 25 µm 75 µm 25 µm 20 µm 50 µm

200 µm

16



SelecZveLaserSolderingAll main issues were solved •  Quality of the metallization of FPC VIAs •  Excessive warping of pixel chip •  Assembly jigs out of tolerance

Nevertheless the result continue to be unsatisfactory => too often “cold” soldering or partial wetting of the pad

We investigated in detail (optical inspections, SEM, FIB and EDS analysis) the quality of the metallization of the interface pads, but everything seems according to specs

FIBinspecBon

Feb 2016 – Decision to abandon laser soldering and use conventional wire bonding

17



Possibile spiegazione o meglio la nostra interpretazione dei risultati supportata da numerose discussioni con esperti del settore

Quando la sferetta di saldatura è fusa, il trasferimento di calore al chip è troppo veloce e di conseguenza la temperatura all’interfaccia si riduce molto rapidamente, tanto da non permettere la formazione dello strato intermetallico.

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Wire-bonding


10 µm 25 µm 75 µm 25 µm 10 µm 100 µm

500 µm

Chip%FPC%

Solder%balls%

Laser%

Chip

Coverlay Metal

Polyimide Metal

Coverlay

•  Il chip è incollato con una colla non conduttiva al circuito stampato flessibile (FPC)

•  Interconnessione elettrica è stabilita mediante la tecnica consolidata di wedge wire-bonding attraverso il via del FPC

Primi test a Gennaio con assemblaggi di chip singoli

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Wire-bonding


Test con pALPIDE-3 e FPC singolo chip •  5 assemblaggi con filo di Al da 25mm wedge

tool standard (45°) •  1 assemblaggio con filo di Al da 25mm e

wedge tool deep-access •  Risultati: tutti funzionanti secondo specifiche

10 µm 25 µm 75 µm 25 µm 10 µm 100 µm

500 µm

Chip%FPC%

Solder%balls%

Laser%

Chip

Coverlay Metal

Polyimide Metal

Coverlay

Primi test a Gennaio con assemblaggi di chip singoli

20

EDR – Modulo e Stave


ReviewPanel:DiegoAlvarezFeito(CERN),NicolaBacche_a(INFN),HeinzPernegger(CERN), WalterSondheim(LANL)

ALICE&ITS&Stave&Engineering&Design&Review&

May&384,&2016&

Introduction:+

The&Committee&wishes&to&congratulate&the&ITS&project&team&on&the&high&quality&of&the&material&presented,&which&demonstrated&the&exceptionally&good&progress&made&with&design&of&components&for&this&ambitious&upgrade.&Several&important&issues&have&been&addressed&and&were&presented:&from&ALPIDE&design&towards&the&production&version,&the&designs&of&FPCs,&mechanics&and&cooling&for&staves&and&the&overall&assembly&and&testing&of&HIC&and&staves&for&IB&and&OB.&Several&issues&have&been&identified&and&overcome&&(eg&connection&FPC&to&chip,&ALPIDE&functionality&in&the&system).&The&component&designs,&assembly&setups&and&initial&results&on&early&HIC&prototypes&and&staves&look&generally&convincing&and&there&are&strong&and&experienced&teams&involved.&It&is&clearly&understood&that&the&next&months&are&critical&to&obtain&decisive&test&results&on&more&prototypes&for&production&readiness,&but&the&Committee&did&not&identify&any&show8stoppers&at&this&point.&More&detailed&remarks&and&recommendations&follow.&&

Remarks/Recommendations:+

The&committee&would&like&to&thank&the&entire&ITS&team&for&the&excellent&presentations&being&available&ahead&of&the&review.&Initial&reviewer&questions&and&answers&by&the&ITS&team&are&attached&the&review&agenda.&

1.) General+&

a.) Full&slice&system&test:&The&gradual&construction&of&the&full&slice&system&test&including&all&electrical&and&relevant&mechanical&parts&is&important&to&qualify&the&designs&of&all&components&(from&chip/FPC&to&HIC&,&DC/DC,&RU&,&cables).&The&system&test&activities&shall&be&pursued&with&high&priority&so&that&further&results&are&available&until&the&PRR.&

b.) Redundancy:&On&the&outer&barrel&the&failure&of&e.g.&a&master&chip&may&lead&to&the&loss&of&6+1&chips&(half8HIC).&Additionally&the&replacement&of&a&HIC&on&a&half8stave&seems&very&difficult&to&impossible.&Based&on&an&analysis&of&possible&failure&modes,&it&may&be&prudent&to&investigate&possibilities&for&more&redundancy&even&at&the&expense&of&a&small&mass&penalty&in&the&outer&layers.&&

&&

2.) Readout+&+Electronics++

a.) Data&transmission/data&corruption&issues&(due&to&pickup&on&supply&voltages)&have&been&addressed&in&the&latest&ALPIDE&version.&Further&checks&are&needed&once&the&new&chip&is&back.&

b.) With&the&production&version&of&the&ALPIDE&being&available,&dedicated&noise&test&should&be&pursued&with&DC/DC&converters.&&

3.) HIC+assembly++

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Milestones Tracker - ALPIDE,IBstaves,OBstaves


ITSMaster_Plan_V2(Sep-15) 2015 2016 2017 2018 2019 2020

ALPIDEEDR(10/15)

ALPIDEPRR(7/16)

ALPIDEproduct.andtest(end7/17)

IBstaveEDR(3-4/5/16)

IBstavePRR(8/16)

IBFPCproducBonend(9/17)

IBspaceframe&coldplateprod.end(9/17)

IBstaveproducBonend(1/18)

IBassemblyend(3/18)

OBstaveEDR(3-4/5/16)

OBstavePRR(12/16)

OBFPCproducBonend(12/17)

OBspaceframe&coldplateprod.end(1/18)

OBHICproducBonend(4/18)

OBstaveproducBonend(7/18)

OBstaveassemblyend(10/18)

May2016

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Milestones Tracker - ROelectronics,mechanics&cooling, commissioning,installaZon


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ITSMaster_Plan_V2(Sep-15) 2015 2016 2017 2018 2019 2020

ROelectronicsEDR(12/16)

ROelectronicsPRR(12/17)

ROelectronicsprod.end(12/18)

DetectorbarrelEDR(7/16)

DetectorbarrelPRR(11/16)

Detectorbarrelprod.end(7/17)

Servicebarrel/cageEDR(9/16)

Servicebarrel/cagePRR(2/17)

Servicebarrel/cageprod.end(9/17)

CoolingplantEDR(7/16)

CoolingplantPRR(10/16)

Coolingplantready(9/18)

Commissioningsurfaceend(5/19)

InstallaBonduringLS2(7/20)

14monthsconBngency

May2016

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Nuovo Coordinatore Nazionale ITS Upgrade dal 1 Aprile 2016

Stefania Beolè (To)


Thank you !

24 V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016

Stato ALICE e ITS Upgrade · V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016 2 months:...

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