IBL – Stato del Progetto, Attività e Richieste

IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 2009o

IBL – Stato del Progetto,Attività e Richieste

IBL – Stato del Progetto,Attività e Richieste

Roma, July 23rd, 2009G. Darbo - INFN / Genova

Agenda Page:

IBL – Attività e RichiesteG. Darbo - INFN / Genova ATLAS Italia - Roma, 23 July 20092

PROJECT STATUSPROJECT STATUS


IBL StatusIBL StatusProject formally started:

• Project Leader endorsed by CB (Feb 2009)• IBL Management Board – Endorsed by ATLAS Executive Board (April 2009)• IBL (Institute Board) Kick-off meeting – July 8th

• To converge towards a MoU for the IBL project

TDR• Editor (K. Einsweiller) and Chapter Editors selected – Final version April

2009.

Guide line for project schedule (ATLAS UPO – 21/7/2009)• target the installation for the second half of 2014. (shutdown 2014/15) • assume an 8 months shutdown time for the IBL installation• decouple the IBL installation from the LHC phase 1 upgrade (!)

Last IBL General Meeting June 25th & 26th • 42 talks – 2 full day technical discussion• Whole project covered including software• http://indico.cern.ch/conferenceDisplay.py?confId=54685

Institutes Present at the IBL kick-off


IBL Project & OrganizationIBL Project & OrganizationThe IBL (Insertable B-Layer) is an ATLAS Upgrade project:

• It will deliver a fourth pixel layer, including a new beam-pipe, to the Inner Detector

• When delivered, it will become a part of the Pixel Detector and of the Inner Detector and the organization will be “absorbed” into the Pixel & ID

The organization structure has:• IBL MB: Management Board to execute the project

• IBL IB: Institute Board, is an extension of the existing Pixel IB

Module WG

Module WG

IBL MB(Management

Board)

IBL MB(Management

Board)

StaveWG

StaveWG

I&IWGI&IWG

Off-detWG

Off-detWG

IBL IB(Institute Board)

IBL IB(Institute Board)

Pixel Institutes

in IBL

Pixel Institutes

in IBL

New Institutes

in IBL

New Institutes

in IBL

ATLASUPO

ATLASUPO

ATLAS UPGRADE

IBL

IBL PLIBL TC


Management Board (MB)Management Board (MB)

Module WG(2 coordinators)•FE-I4•Sensors•Bump-Bonding•Modules•Test & QC•Irradiation

Module WG(2 coordinators)•FE-I4•Sensors•Bump-Bonding•Modules•Test & QC•Irradiation

Stave WG(1 Phys + 1

Eng.)•Staves•Cooling Design & Stave Thermal Management•HDI•Internal Services•Loaded Stave•Test & QC

Stave WG(1 Phys + 1

Eng.)•Staves•Cooling Design & Stave Thermal Management•HDI•Internal Services•Loaded Stave•Test & QC

IBL Integr.-Install.(2 Eng.)

•Stave Integration•Global Sup.•Beam Pipe (BP)•Ext.services inst.•IBL+BP Installation•Cooling Plant•Test & QC

IBL Integr.-Install.(2 Eng.)

•Stave Integration•Global Sup.•Beam Pipe (BP)•Ext.services inst.•IBL+BP Installation•Cooling Plant•Test & QC

Off-detector(1 Phys + 1 E.Eng.)•Power•DCS•ROD•Opto-link•Ext.serv.design/proc.•Test Beam•System Test

Off-detector(1 Phys + 1 E.Eng.)•Power•DCS•ROD•Opto-link•Ext.serv.design/proc.•Test Beam•System Test

IBL Management BoardMembership:•IBL PL + IBL TC•2 coordinators from each WG•Plus “extra” members

IBL Management BoardMembership:•IBL PL + IBL TC•2 coordinators from each WG•Plus “extra” members

Ad-interim membershipIBL Project Leader: G. DarboIBL Technical Coordinator: H. Pernegger“Module” WG (2 Physicists): F. Hügging & M. Garcia-Sciveres“Stave” WG (1 Phy. + 1 M.E.): O. Rohne + D. Giugni“IBL Assembly & Installation” WG (2 M.E. initially, a Phy. Later): N. Hartman + R. Vuillermet“Off-detector” WG (1 Phy. + 1 E.E.): T. Flick + S. Débieux“Extra” members:Ex officio: Upgrade Coordinator (N. Hessey), PO Chair (M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells), Pixel Chair (C. Gößling)Offline “liaison” Pixel Off-line coordinator: A. AndreazzaTDR editor (temporary): K. Einsweiler


TECHNICAL OVERVIEWTECHNICAL OVERVIEWFor more information – CSN1 November ’08 & March ’09


Requirements for Sensors/ElectronicsRequirements for

Sensors/ElectronicsRequirements for IBL

• IBL design Peak Luminosity = 3x1034 cm-2s-1 New FE-I4, higher hit rate• Integrated Luminosity seen by IBL = 550 fb-1

• Total NIEL dose = 2.4 x 1015 ± 30% (σpp) ± 50% (damage factor) = 4.7 x 1015 neq/cm2

more rad-hard sensors• Total radiation dose > 200 Mrad

€

Φ(r) =493

r2+

25

r

⎛

⎝ ⎜

⎞

⎠ ⎟×1014

• Fit made for 2 < r < 20 cm for L=1000fb-1

• Gives for IBL @ 3.7 cm (550 fb-1):

Φ1MeV=2.4x1015 (1.2 MGy)

• Safety factors not included in the computation (pp event generator: 30%, damage factor for 1 MeV fluences: 50%)Ref. Ian Dawson - AUW


Ref: N. Hartman:•http://indico.cern.ch/conferenceDisplay.py?confId=43496

Predominant Stave LayoutsPredominant Stave LayoutsSeveral layouts under study: 14 staves at Rmin=~3.2 cm• Single and double staves – One or two (redundant) cooling channels

Inverted

Sensor Sensor

Biturbine


• The beam pipe flange on A-side is to close to the B-layer envelope . Need to be cut on the aluminum section

• A structural pipe is inserted inside the Beam Pipe and supported at both sides.

• The support collar at PP0 A-side is disassembled and extracted with wires at PP1.• Beam pipe is extracted from the C-side and it pulls the wire at PP1

• New cable supports are inserted inside PST at PP0.

• A support carbon tube is pushed inside the PST along the structural pipe.

Started to setup a 1:1 mock-up of Pixel/beampipe/PP1 in Bat 180

A-side C-side

IBL Installation: Beam Pipe Extraction

IBL Installation: Beam Pipe Extraction


IBL Installation Scenario IIBL Installation Scenario I

• The support carbon tube is fixed in 2 point of PP0 and on PP1 walls on side C and A.

• The structural pipe with a support system is moved out from the support carbon tube.

• The new beam pipe (in any configuration with OD up to 82,5 mm) is inserted from C-side. It has 2 supports at PP0 area and 2 floating wall at PP1 on side A and C.


Module Layout - ConvergenceModule Layout - ConvergenceDecision between Planar and 3D sensors will be done after TDR• Need module prototypes with FE-I4 (second half 2010)

Common sensor baseline for engineering and system purposes• 3D sensors – single chip modules / Planar sensors – 2 chip modules

Sensor/module prototypes for ~10% of the detector in 2010• Stave prototype tested with modules and cooling

Credits: M.Garcia-Sciveres – F. Hügging


FE-I4 StatusFE-I4 Status

FE-I4 Status• Prototype blocks in MPW (MOSIS) submitted 3/2008,

measurements, irradiation

• Design review (3/2009): “system & design issue” on full scale design

• FE-I4 Design Collaboration Meeting - July 1st & 2nd ‘09

• Pre-submission design review – end of Sept./Oct.

• Submission ~ 1month later


Test Beam (June ‘09) – FBK 3D Sensors

Test Beam (June ‘09) – FBK 3D Sensors

Comparison of 3D and Planar• Test beam with magnetic field

• Planar sensors are sensitive to Lorentz angle: maximize charge at incidence angle = Lorentz angle

• 3D (electric field parallel to sensor surface) are not.

• Active edge: ~5 to ~10 µm from edge (see picture at the right)

3D FBK ToT at 15o 3200e-

planar


INFN ACTIVITY 2009/10INFN ACTIVITY 2009/10


BO (GE) : Attività 2010 (ROD)BO (GE) : Attività 2010 (ROD)

BO new entry in “Pixel World”• Expertise in complex digital architecture • Design and production of new ROD – in

collaboration with GE (P. Morettini)

Pix ROD

Pix RODUpdate

FPGA/DSP e-BOC BOC

Test SystemModule/Stave/

Test Beam

IBL RODNew Board

Port FPGA/DSP code

IBL ROD DevDevelopment

System for IBL ROD

Upgraded Test System

Proto System Test(Use for Stave Test?)

System Test

IBL R/O

2009

2010

2011

2012

2013

Bologna

Genova


Sensori 3D• Sono una dei tipi si sensori che

potrebbero essere gia’ usati per l’IBL e, in futuro, per il tracciatore di ATLAS per sLHC.

• Sensori prodotti all’IRST Trento, bump-bondati all’AMS con FEI3, assemblaggio e test in Genova.

• Risultati incoraggianti sia dai test di laboratorio che al test beam.

Progettazioni servizi interni• Disegno dei servizi a PP0

(dall’elettronica di Front end alla fine dello stave)

• Forti constraint imposti dalla minimizzazione del X0, dall’elettronica (caduta di potenziale), procedure di assemblaggio. TOT

Misura dellacarica rilasciataal test beam

Noise

GE : Attività 2009GE : Attività 2009


Sensori 3D• Sono una dei tipi si sensori che

potrebbero essere gia’ usati per l’IBL e, in futuro, per il tracciatore di ATLAS per sLHC.

• Sensori prodotti all’IRST Trento, bump-bondati all’AMS con FEI3, assemblaggio e test in Genova.

• Risultati incoraggianti sia dai test di laboratorio che al test beam.

Progettazioni servizi interni• Disegno dei servizi a PP0

(dall’elettronica di Front end alla fine dello stave)

• Forti constraint imposti dalla minimizzazione del X0, dall’elettronica (caduta di potenziale), procedure di assemblaggio.

Bus

FE/module Pigtail

JunctionBus-Pigtail

Wire-BondingsFE- Pigtail

1.11

LV1 LV2 LV3 LV4GND1 GND2 GND3 GND4

Signals for mod1

Signals for mod2

Signals for mod3

Signals for mod4



Sensori 3D• Continua la stretta collaborazione con l’IRST testando i sensori

da loro prodotti e dando feedback. • Bump Bonding all’AMS, Assemblaggi e test in laboratorio• Test beam al Cern• irraggiamento

Produzione prototipi flex bus e pigtail• Prima prototipaggio al CERN• Test elettrici, in particolare propagazione dei segnali – 160

Mbits per 7m)• Studio e test:

• Incollaggio sul supporto meccanico del bus (critico per il CTE)• Incollaggio dei pigtail sui moduli (critico per il wire bonding)• Giunzione dei pigtail al flex

FEI4• Sviluppo del chip• Test setup per test delle nuove device• Integrazione con la DAQ (ROD/BOC, software)

Supporto in lavorazione stave (in collaborazione con Mi)



MI : Attività 2009MI : Attività 2009

Design e produzione prototipi carbon pipes per stave “omogeneo”.• Gestione della produzione prototipi CF pipe (Stoccarda)

[produzione in Sezione tooling, facilities, dwgs] • Qualifica a pressione e leak-rate

Simulazione per il calcolo:• della figura di merito dello stave• del thermal run-away.• Del CTE della pipe e della resistenza strutturale

Misura della conduttivita trasversa del laminato della pipe.

Sviluppo connessione CF/Ti per cooling Pipe.

19


MI : Attività 2010MI : Attività 2010PP2 boxes con relativo re-design delle regulator-boards.• Il progetto IBL prevede l’utilizzo di un nuovo chip in tecnologia

0.13mm (FEI4) e quindi con diversi valori di tensione e corrente• Studio delle modifiche da apportare alle LV regulation station, in

particolare con re-design delle boards di connessione per minimizzare Vdrop lungo le linee di alimentazione

Verifica resistenza alla crescita di micro-cricche nella matrice del laminato della pipe sotto tensione e dopo irraggiamento [reattore PV].

Cooling [supporto di personale e setups di test]• Qualifica della CF pipe e stave su sistema evaporativo a C3F8 (o

blends) o CO2• Verifica transitori termici e max T build-up su sensori durante il

bake-out della beam pipe


Full 3D detectors (passing through columns) with slim edge are proposed

Double-side technology approach, already proved on test structures of 250 mm thickness.

One batch with FE-I3 ATLAS single chips is currently being fabricated

250 m

TN/UD/FBK (GE) : Attività 2009TN/UD/FBK (GE) : Attività 2009


From TCAD simulations, a 170 m distance between active area and saw cut is feasible.

With this structure, a steep increase in the current due to edge contribution takes place at Vrev ~ 200V (well beyond operation voltage)

Post irradiation, edge current is not an issue

Saw cut

FBK : Slim EdgeFBK : Slim Edge


UD : Simulazioni TCADUD : Simulazioni TCAD

Numerosi processi (anche su farmts)

Simulazioni 2D su sezioni orizzontali e verticali• incluse impiantazioni superficiali e p-spray• idonee per valutare l’insorgere del breakdown

• distanza critica fra colonne e impiantazioni superficiali

• carica deposta nell’ossido dalla radiazione incidente (QOX)

Simulazioni tridimensionali• utilizzate per stime di capacità


UD (TN) : Attività 2010UD (TN) : Attività 2010


FINANCIALFINANCIAL


CostCost

What in prototype costs:• Sensors: Planar, 3D, Diamond (1)

• Electronics: FE-I4

• Hybridisation: bump-bonding

• Local supports: stave

• Beam-pipe: mock-up

• External cooling: Thermal management

What not:• All other electronics / mechanical prototypes

• Irradiation and test beam

(1) Diamond prototype added to cost - if diamond are the IBL sensors, the IBL cost will increase by > 1MCH.


WBS - INFNWBS - INFN

INFN deliverables: 932kCH 17 %Not covered: 143 kCH

Total : 1075 kCH 19 %

INFN deliverables: 932kCH 17 %Not covered: 143 kCH

Total : 1075 kCH 19 %


Some “Envelopes” to Shape Participation

Some “Envelopes” to Shape Participation

IBL Total Cost: 9.6 MCH• M&O-A: 4.0 MCH• M&O-B (for Countries with “pixel M&O-B” budget line – listed in the

table): 4.4 MCH• CZ, F, D-BMBF, D-DESY, I, RZ, US, CERN

• New project contributions: 1.2 MCH• CH, E, N, UK

IBL M&O-B:• There are not a-priory boundaries

amongst Countries, but some reference can be considered fromthe old Pixel CORE to evaluate howcountries are consolidated in the“pixel technology” needed for IBL

MoU• Interim-MoU – i-MoU first version is expected to be available by the

end of the year and should converge to final MoU with the writing of the TDR.


INFN Contribution to IBLINFN Contribution to IBL

INFN Contribution proposal:• Assigned for deliverables:

932 kCH (16.4%) + “not covered”: 143 kCH = 1075kCH (19 %)

• M&O-A: frazione secondo regole ATLAS

• Cost divided in deliverables + common orders (Sensor, FE-I4, bump-bonding) + cash + M&O-A


BO : Richieste 2010BO : Richieste 2010


GE : Richieste 2010GE : Richieste 2010


MI : Richieste 2010MI : Richieste 2010


UD (TN) : Richieste 2010UD (TN) : Richieste 2010


BACKUP SLIDESBACKUP SLIDES


3D Sensors3D Sensors

Large collaboration• 15 Laboratories and 3 processing facilities

Thickness 230±15 mModule type single FE-I4 assembly#electrode 2 per 250mEdge active 5m Edges guard 200m Signal (5x1015) ~12500 e-

Bias (5x1015) ~150VWcm-2( 5x1015) 33mW at -10oCLorentz angle before irr. freeEfficiency (3200 e-) 96% (0o) 99% (15o)Wafer dim. 4”Expected yield ~50%Bias bump-b and pad

FBK & CNM

SINTEF/Stanford

Credits: C. Da Via on behalh of ATLAS 3D Sensor R&D


Bologna - ActivityBologna - Activity

Schedule and estimation of resources for IBL ROD

IBL – Stato del Progetto, Attività e Richieste

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